| 摘要 |
PROBLEM TO BE SOLVED: To suppress generation of a solder ball by adding a prescribed compound in a flux. SOLUTION: In the solder paste, amine-organic acid halogenide hydroacid is added to the paste-like or liquid flux as an activator. More specifically, amino-benzoic acid hydrobromic acid salt is included. The quantity to be added in the flux is preferably 0.1∼5%. If the quantity to be added exceeds this value, it may cause corrosion. Frequent generation of the solder ball is controlled, and at the same time, the temporal stability can be kept.
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