| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the adhesion of dust to chip components and scratching of the components without raising the clean level of facilities. SOLUTION: A method for manufacturing semiconductor device includes a process in which a resin thin film 2 is formed on the surface of a substrate 1 and a transparent protective film 3 composed of a heat-shrinkable film carrying an ultrasonic-curing adhesive 31 is stuck to the surface of the thin film 2 with a prescribed adhesive strength, a process in which a dicing sheet is stuck to the rear surface of the substrate 1 after the rear surface is shaved off until the substrate 1 has a prescribed thickness. The method also includes a process in which the transparent protective film 3 is cured by irradiating the film 3 with ultraviolet rays after an element member is formed by cutting the substrate 1 from the surface of the film 3 and the element member is taken out from the dicing sheet while the film 3 is stuck to the thin film 2 and a process in which the film 3 is heated so that the film 3 can shrink and comes off from the thin film 2 by itself after the element member is mounted on a prescribed package member.</p> |
