发明名称 APPARATUS AND METHOD FOR PASTING TOGETHER DISK SUBSTRATES
摘要 PROBLEM TO BE SOLVED: To obtain an apparatus and a method in which a disk substrate is positioned easily so as to be pasted precisely by a method wherein a first disk holding device, a second disk holding device and an adhesive-piece holding device constitute mounting faces on which respective substrates and adhesive pieces can be mounted. SOLUTION: A first disk substrate 10 is moved to a precise position by a central shaft 13, a suction part 15 is operated, the air is sucked from suction ports 15a, 15b, and the substrate 10 is sucked to, and held by, a mounting face 12 by its suction action. Then, a second disk substrate 20 is moved to a precise position by a central shaft 23, a suction part 25 is operated, the air is sucked from suction ports 15a, 15b, and the second disk substrate 20 is sucked to, and held by, a mounting face 22 by its suction action. In addition, a double-sided adhesive piece is moved to a precise position by a central shaft 33, a suction part is operated, the air is cucked from a suction port 35a, and the double-sided adhesive piece is sucked to, and held by, a mounting face 32 by its suction action. Thereby, the disk substrates and the double-sided adhesive piece are fed and positioned easily so as to be pasted precisely.
申请公布号 JPH09330536(A) 申请公布日期 1997.12.22
申请号 JP19960171699 申请日期 1996.06.11
申请人 LINTEC CORP 发明人 TAKAHASHI TOSHIHITO;KIMURA TETSUAKI
分类号 G11B7/26;G11B7/24 主分类号 G11B7/26
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