SEMICONDUCTOR AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To improve the wire bonding property of a semiconductor device using a wiring pattern film composed of a resin film carrying a wiring pattern on one surface. SOLUTION: At the time of manufacturing a semiconductor device in which a semiconductor element 22 is mounted on the wiring pattern forming surface of a wiring pattern film 16 composed of a resin film 10 carrying a wiring pattern 14 on one surface and the connection pads 24 of the element 22 and the bonding pads 17 of the wiring pattern 14 are electrically connected to each other via wires 26, a projecting section 38 formed on a heat block 34 is inserted into a hole section 32 which is opened on the other surface side of the film 10 and on the bottom of which the rear surface of the film 10 corresponding to the surface of the bonding pads 17 connected with wires 26 is exposed and middle sections of wires joined to the connection pads 24 of the element 22 are thermocompression bonded to the bonding pads 17 while the pads 17 are heated.