PRINTED CIRCUIT BOARD AND METHOD FOR LAMINATING SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board on which bare chips can be easily and inexpensively mounted in a laminated state and a method for laminating semiconductor chips. SOLUTION: A first-layer bare chip 18a is fixed on a printed wiring board 12 in a state where the back 24 of the chip 18a faces the board 12 and conductive projections 34 are formed on the electrodes 20 of the chip 18a. The projections 34 are electrically connected to pads 16 on the printed wiring board through conductive wires 32. Then a second-layer bare chip 18b is mounted on the first-layer semiconductor chip in a state where the electrode forming surface 22 of the chip 18b faces that of the chip 18a and the electrodes of the chip 18b are brought into contact with the conductive projections 34 of the chip 18a.