| 发明名称 |
RADIATION CURABLE RESIN COMPOSITION |
| 摘要 |
A radiation curable resin composition comprising (A) a first linear (meth)acryloyl and aromatic group-containing compound, (B) a second branched (meth)acryloyl group-containing compound, (C) a radiation polymerization initiator, and (D) silica particles having a secondary average particle diameter of 0.5 to 5 mu m. The composition is suitable for use as a printable heat-resistant protective coat which is used for information recording media such as thermosensible recording cards and thermosensible photographic printing paper.
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| 申请公布号 |
WO9747671(A1) |
申请公布日期 |
1997.12.18 |
| 申请号 |
WO1997NL00334 |
申请日期 |
1997.06.12 |
| 申请人 |
DSM N.V.;JAPAN SYNTETIC RUBBER CO., LTD.;JAPAN FINE COATINGS CO., LTD.;TAKAHASHI, TOSHIHIKO;KATO, KEIKO;WATANABE, TSUYOSHI |
发明人 |
YUICHI ERIYAMA;TAKASHI UKACHI;WATANABE TSUYOSHI;ERIYAMA YUICHI;UKACHI TAKASHI |
| 分类号 |
C08F2/46;C08F2/54;C08F20/10;C08F220/28;C08F290/00;C08F290/06;C08K3/36;C09D4/02;C09D163/10;(IPC1-7):C08F290/06 |
主分类号 |
C08F2/46 |
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