发明名称 |
Verfahren zur Herstellung eines Gehäuses für integrierte Schaltungen mit Aushöhlung und interner Sperrdichtung |
摘要 |
A method of producing a cavity package (31) around an assembled semiconductor device (24) is disclosed. The method includes providing a chip attach pad (25) having a plurality of chip attach pad straps (33), each strap extending outwardly from the outer edge of the chip attach pad and spaced about the edge of the bar pad; mounting integrated circuits (24) having bond pads on the chip attach pad; molding a package material (31) onto a central portion of lead fingers (28) and the chip attach pad straps to grip and surround each lead finger with package material, with a portion of each lead finger extending externally from the ring (31) at both the exterior and interior thereof and to secure the chip pad straps (33) therein; electrically coupling the bond pads to the portion of desired ones of the lead fingers extending toward the interior the ring; and enclosing both ends of the ring to provide a cavity (34) in the ring to suspend a chip attach pad with the integrated circuit thereon within the cavity with the chip pad straps. Heat sinks can also be used to promote high levels of thermal dissipation. |
申请公布号 |
DE69031248(T2) |
申请公布日期 |
1997.12.18 |
申请号 |
DE1990631248T |
申请日期 |
1990.05.31 |
申请人 |
TEXAS INSTRUMENTS INC., DALLAS, TEX., US |
发明人 |
BEDNARZ, GEORGE A., AUSTIN, TEXAS 78731, US |
分类号 |
H01L23/12;H01L21/50;H01L21/60;H01L23/02;H01L23/04;H01L23/28;H01L23/495;H01L23/50 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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