A carrier element for a semiconductor chip (23), in particular for mounting in chip cards, has a substrate (15) that carries the chip (23) and a reinforcing foil (10) laminated on the side of the substrate (15) that carries the chip (23). The reinforcing foil (10) has a recess (14) for receiving the chip (23) and its connection lines (24), whose edge is provided with a frame (12) that forms a single piece with the foil (10).
申请公布号
WO9748133(A1)
申请公布日期
1997.12.18
申请号
WO1997DE01170
申请日期
1997.06.10
申请人
SIEMENS AKTIENGESELLSCHAFT;HUBER, MICHAEL;STAMPKA, PETER;HOUDEAU, DETLEF;FISCHER, JUERGEN;HEITZER, JOSEF;GRAF, HELMUT
发明人
HUBER, MICHAEL;STAMPKA, PETER;HOUDEAU, DETLEF;FISCHER, JUERGEN;HEITZER, JOSEF;GRAF, HELMUT