| 摘要 |
The method for mounting an integrated circuit (11) on a carrier (10) comprising a structure (13) of leads (14) consists in connecting the leads to the respective integrated circuit terminals (12) without using a portion of the carrier to insulate the integrated circuit leads as in the standard TAB technology. The connection can be made directly by thermocompression or ultrasonic means, or indirectly via balls. The insulation between the leads and the integrated circuit is achieved by insulating means only after the connection has been made. The insulating substrate of the TAB carrier (10) can be fixed to the leads outside the integrated circuit, before or after connecting the leads. |
