Carrier for semiconductor chip mfr. esp. for construction of smart cards

摘要

The carrier sheet for a semiconductor chip (23) has a substrate (15). A reinforcing foil or film (10) is laminated on the chip side of the substrate (15). The foil has a recess (14) to receive the chip and its connecting leads (24). The edge of the recess has a frame (12) formed integrally with the foil. The substrate may be a metal foil. Alternatively it may be a non-conductive foil on which a conductive foil (20) structured in contact surfaces is laminated. The reinforcing foil may be made of metal or plastic. To manufacture the carrier element, a recess (11) is formed in the reinforcing foil. The base of the recess is punched out. The resulting reinforcing foil with the frame at its edge is laminated on the substrate.