LEAD-FREE, HIGH TIN TERNARY SOLDER ALLOY OF TIN, SILVER, AND BISMUTH
摘要
<p>A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin, from about 5 to 27.5 wt.% bismuth and 2 to 7.5 wt.% silver.</p>
