INTEGRATED CIRCUIT DEVICE

摘要

The present invention relates to integrated circuit devices for use in such civilian equipments as an electronic equipment, electrical equipment, communication equipment and measuring and controlling equipment, and its object is to provide an integrated circuit device which has an excellent heat radiating characteristic. Then, in order to achieve this object, it includes, on a metal board 1, a power supply 4 and a plurality of pin terminals 5 and includes, on a multi-layer circuit wiring board 7, mounted component parts comprising a cache controller 10, a cache memory section 11, a data buffer LSI section 14, a CPU chip 8 and a connector 12; and, by mounting a reverse surface of the multi-layer circuit wiring board 7 having the mounted component parts provided thereon on the metal board 1 having the power supply 4 provided thereon through the pin terminal group 5, it is possible to provide an integrated circuit device in which the degree of integration is enhanced and the heat radiating characteristic of heat generating component parts is excellent.