Method for manufacturing multilayer wiring board and wiring pattern forming apparatus

摘要

To form in a batch manner a thin-film wiring pattern in high precision over an entire region of a ceramics multilayer wiring board containing distortion and deformation, a correction amount of the ceramics multilayer wiring board (1) (rotation angle and movement amount of position of this ceramics multilayer wiring board) is calculated in a computer by applying, for instance, the least squares method to positional coordinate values of each of the LSI mounting areas (3) of the ceramics multilayer board and also to positional coordinate values corresponding thereto on a photomask (9). A support apparatus for supporting the multilayer wiring board (1) is controlled based upon the calculated correction amount, so that the multilayer wiring board (1) can be aligned with respect to the photomask (9). <IMAGE>