| 摘要 |
<p>PROBLEM TO BE SOLVED: To attain a heat radiation structure capable of dealing with tendecy electronic circuit toward high performance, high speed and high density, and having a high cooling effect, in respect to the heat radiation structure of a module of electronic equipment. SOLUTION: A heat radiation board 2 having a size matching with the shape of a printed board 1 is constituted so as to hold a prescribed interval from the surface of the board 1 and come into contact with a heating component 6. Since the number of heat radiation parts can be reduced by this means, the heat radiation structure of the module capable of physically protecting parts loaded on the printed board 1 allowed to easily substitute parts by simple structure and efficiently radiating heat from the heating component 6 on the board 1 is provided.</p> |
