| 摘要 |
<p>PROBLEM TO BE SOLVED: To assure stable connectability and improved reliability of a semiconductor device, by Ag plating at least exposed part of a lead from resin package for making solder plating needless for the completed products. SOLUTION: Within an LOC structured SOJ type semiconductor device, wherein the formed surface of a terminal pad 15 of a semiconductor ship 14 is bonded onto an inner lead 10a through the intermediary of a bonding agent 16 and after connecting this inner lead 10a to the terminal pad 15 by an AU line 17, the semiconductor chip 14 and a bonding part are sealed with a resin mold 18, at least the exposed part of an outer lead 10b from the resin mold 18 is Ag plated, thereby making solder plating needless for the completed products.</p> |
