发明名称 Jordingsplankobling
摘要 A flexible circuit construction allows solder balls to be mass reflow attached to the ground plane of a double-sided flexible circuit by providing a first via which is separate from the remainder of the ground plane, but which is electrically connected to the ground plane through a second via at a distance from the first via by a circuit trace on the side of the flexible circuit opposite the ground plane.
申请公布号 NO975928(D0) 申请公布日期 1997.12.16
申请号 NO19970005928 申请日期 1997.12.16
申请人 MINNESOTA MINING AND MANUFACTURING CO 发明人 SCHUELLER, RANDOLPH D.
分类号 H05K3/34;H01L21/60;H01L23/12;H05K1/00;H05K1/02;H05K1/11;H05K3/28;H05K3/36;(IPC1-7):H05K3/34;H01L23/498 主分类号 H05K3/34
代理机构 代理人
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