METHOD OF THIN PLATE HOLDING AND MEASURING APPARATUS OF THIN PLATE SHAPE

摘要

PROBLEM TO BE SOLVED: To provide a method of thin plate holding and a measuring apparatus of a shape of a thin plate to measure its shape exactly getting rid of the influence of its own weight of the thin plate of a large diameter, such as a silicon wafer. SOLUTION: A method of holding of a thin plate is formed as that a saucer shaped thin plate is contacted by holders at its circumference and both faces of the thin plate are blown by air at its opposite spot of both faces and is held by the force of the air acting on both faces. A saucer shaped thin plate (wafer) 1 is held at its circumference by the holders (rotary rollers) 2A∼2G and both its faces are arranged between the upper nozzle pipes 3A∼3C and the lower nozzle pipes 4A∼4C and is held floating capable of rotation among the holder 2 by the force of the blown from the nozzle pipe 3 and 4.