| 摘要 |
A curing device for drying bonding material used for bonding, for example, chips to a lead frame for semiconductor devices including a workpiece heating chamber casing having heating blocks for heat-drying the bonding material and a gas supply chamber casing provided above the workpiece heating chamber casing so as to cover the heating chamber casing and to supply a high-temperature gas to the surfaces of the heating blocks, and the gas supply chamber casing is constructed so that it can be opened and closed with respect to the workpiece heating chamber casing, assuring easy access to the inside of the heating chamber casing for various works such as cleaning of the heating blocks, etc. |
