| 摘要 |
PROBLEM TO BE SOLVED: To enhance the radiation efficiency of a driver IC chip. SOLUTION: An anisotropic conductive material 65 is interposed between the rear surface 61 of a driver IC chip 60 and the side surface 21f of a head 21 to closely bond and fix the driver IC chip 60 and the side surface 21f of the head 21. Further, chip electrodes 62, 63 and head electrodes 68, 69 are electrically connected by the anisotropic conductive material 65. By this constitution, the heat generated in the driver IC chip 60 is conducted to the side surface 21f of the head 21 through the anisotropic conductive material 65 and further conducted to the ink in the head 21. That is, the driver IC chip 60 can be forcibly cooled by the ink. |
