发明名称 MANUFACTURE OF PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE LAYERED PRODUCT, AND FLEXIBLE PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To improve folding resistance, soldering heat resistance, solvent resistance, and flame resistance by containing an epoxy group-containing polyamide resin obtained via the reaction on the specific condition, an epoxy resin, and a photo-cation polymerization initiator. SOLUTION: The polycarboxylic acid component containing the polycarbonatediol modified dicarboxylic acid constituted of the methylene chain with the partially substituted hydrogen of the principal chain by the alkyl group and the carbonate group as the essential component is reacted with diisocyanate on the condition that the equivalent ratio [carboxyl group/isosyanate group] exceeds 1 to obtain a carboxylic acid-containing polyamide resin. An epoxy resin is reacted with this resin on the condition that the equivalent ratio [epoxy group/carboxyl group] becomes 1 or more to obtain an epoxy group-containing polyamide resin. This polyamide resin, an epoxy resin, and a photo-cation polymerization initiator are contained. The compounding quantity of the polycarbonatediol modified dicarboxylic acid is preferably set to 10-100wt.%.
申请公布号 JPH09325491(A) 申请公布日期 1997.12.16
申请号 JP19960138760 申请日期 1996.05.31
申请人 HITACHI CHEM CO LTD 发明人 OBATA RITSUKO;OTA FUMIHIKO;TSUCHIKAWA SHINJI;AMANOKURA HITOSHI;SUZUKI KENJI;NISHIZAWA HIROSHI
分类号 G03F7/004;C08G59/00;C08G59/22;C08G59/28;C08L63/00;C08L77/00;G03F7/029;G03F7/032;G03F7/038;G03F7/40;H05K1/03;H05K3/28;(IPC1-7):G03F7/038 主分类号 G03F7/004
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