发明名称 |
Heat pipe to baseplate attachment method |
摘要 |
An integrated circuit package which has a heat pipe that is incorporated into the body of the package. The package contains an integrated circuit which is mounted to a package substrate. The integrated circuit die is enclosed by a cover plate that is attached to the substrate. The heat pipe is attached to a nut that is screwed into the cover plate. The heat pipe has a bottom surface that is thermally coupled to the die to provide a direct thermal path between the integrated circuit and the heat pipe.
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申请公布号 |
US5699227(A) |
申请公布日期 |
1997.12.16 |
申请号 |
US19960671666 |
申请日期 |
1996.06.28 |
申请人 |
INTEL CORPORATION |
发明人 |
KOLMAN, FRANK;BROWNELL, MICHAEL;XIE, HONG |
分类号 |
H01L23/427;H01L23/433;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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