发明名称 |
Resin composition for electroless metal deposition and method for electroless metal deposition |
摘要 |
Disclosed is a method for electroless metal deposition, which comprises steps of: forming, on the surface of a non-conductive body to be plated, a coating of a resin composition for the electroless metal deposition containing therein a polymer (A) having a chemical structure of at least one compound selected from the group consisting of the below-listed (a), and at least one compound selected from the group of the below-listed (b)1 and (b)2; applying a negative electrostatic voltage to the film coating of the resin composition at a temperature level above the glass transition point of said resin composition; thereafter removing the applied voltage at a temperature lower than the glass transition temperature; and successively carrying out the metal deposition steps inclusive of the catalyst imparting step and the activating step: (a) a chemical structure, in which a part of hydrogen in the main chain of polymer is substituted with the halogen group or the nitrile group, and a chemical structure having a double bond at a portion held between the aromatic substituents in the main chain of the polymer; and (b)1 a polymer (B) having a functional group which is capable of forming a metal salt; and (b)2 a low molecular weight compound (C) having a functional group which is capable of forming a metal salt, and having complete miscibility with the polymer (A) to form one phase.
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申请公布号 |
US5698268(A) |
申请公布日期 |
1997.12.16 |
申请号 |
US19970798027 |
申请日期 |
1997.02.06 |
申请人 |
SANKEI GIKEN KOGYO KABUSHIKI KAISYA |
发明人 |
TAKAGI, KANEYUKI;KITA, TOSHIYUKI;SATOU, KAZUYA |
分类号 |
C23C18/16;H05K1/03;H05K3/18;H05K3/38;(IPC1-7):B05D1/18;B05D3/10;C23C28/00 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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