发明名称 |
Centering apparatus for component mounting device |
摘要 |
A mechanism for picking up and centering a component which is to be placed on an object includes a suction nozzle for holding the component. A first actuator moves the suction nozzle vertically to position the component at a preselected height relative to centering fingers of the mechanism. A second actuator moves the centering fingers horizontally toward the component to center the component being held by the nozzle. A third actuator rotates the suction nozzle (and component) about a vertical axis. The fingers may form vertically spaced component-engaging zones of different shape (e.g., different width and/or thickness) for receiving components of correspondingly different shapes.
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申请公布号 |
US5697658(A) |
申请公布日期 |
1997.12.16 |
申请号 |
US19950435038 |
申请日期 |
1995.05.05 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, JUN-OK |
分类号 |
B65G47/91;H05K13/04;(IPC1-7):B65G47/91;H05K3/30 |
主分类号 |
B65G47/91 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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