发明名称 Centering apparatus for component mounting device
摘要 A mechanism for picking up and centering a component which is to be placed on an object includes a suction nozzle for holding the component. A first actuator moves the suction nozzle vertically to position the component at a preselected height relative to centering fingers of the mechanism. A second actuator moves the centering fingers horizontally toward the component to center the component being held by the nozzle. A third actuator rotates the suction nozzle (and component) about a vertical axis. The fingers may form vertically spaced component-engaging zones of different shape (e.g., different width and/or thickness) for receiving components of correspondingly different shapes.
申请公布号 US5697658(A) 申请公布日期 1997.12.16
申请号 US19950435038 申请日期 1995.05.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, JUN-OK
分类号 B65G47/91;H05K13/04;(IPC1-7):B65G47/91;H05K3/30 主分类号 B65G47/91
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