SEMICONDUCTOR DEVICE MOUNT STRUCTURE AND SEMICONDUCTOR ELEMENT PACKAGE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To easily connect solder terminals by placing a fixing member for fixing an insulation base to an external electric circuit board at areas surrounding regions of terminal pads and connection pads and forming a gap between the insulation base and the circuit board at mounting. SOLUTION: The semiconductor element package has an insulation base 1. Terminal pads 4a are disposed at the lower face of the base 1. An external electric circuit board B has connection pads 7. A frame-like member 8 for fixing the base 1 to the board B is disposed to surround the areas where the pads 4a and 7 are formed. The member 8 is previously bonded to the base 1 so as to partly protrude to specified height from the lower face of the base 1. At mounting of a semiconductor device A on the board B with solder terminals 6, this structure facilitates forming a required gap for mounting the device A having certain height and allows the pads 4a to be satisfactorily connected to the pads 7.