发明名称 |
Electronic control board assembly including embedded lead frames for electrically connecting the circuit boards of the assembly |
摘要 |
An electronic control board assembly has a large-current control unit and a small-current control unit connected to the large-current control unit. The large-current control unit has an insert-molded board with lead frames embedded therein. The insert-molded board has a first component mounting surface and a first component soldering surface facing away therefrom. A first group of components are mounted on the first component mounting surface and have leads extending through the insert-molded board and soldered to the lead frames. The small-current control unit has a printed wiring board which has a second component mounting surface and a second component soldering surface facing away therefrom. A second group of components are mounted on the second component mounting surface and have leads extending through the printed wiring board and soldered to interconnections patterned on the second component soldering surface. The lead frames have ends extending through the printed wiring board and soldered to the interconnections. The first component soldering surface and the second component soldering surface face outwardly.
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申请公布号 |
US5699235(A) |
申请公布日期 |
1997.12.16 |
申请号 |
US19950507729 |
申请日期 |
1995.07.26 |
申请人 |
HONDA GIKEN KOGYO KABUSHIKI KAISHA;NIPPON DENKI HOME ELECTRONICS |
发明人 |
TSURUMIYA, OSAMU;SUDA, HITOSHI;IWASAKI, KAZUYUKI;INOMATA, NAOFUMI |
分类号 |
H05K1/18;H05K1/02;H05K1/14;H05K3/20;H05K3/22;H05K3/34;H05K3/36;H05K5/00;H05K7/14;(IPC1-7):H01R9/09;H01R23/68 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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