| 摘要 |
PROBLEM TO BE SOLVED: To judge the wire bonding condition of a semiconductor pellet, without having influence on the current flow direction by using an a-c current for conduction between the wire and pellet. SOLUTION: The wire bonding operation uses a controller 21 which instructs a switch s to turn on to apply a voltage between the wire 12 and the pellet 15 until a capillary 11 arrives at a lead 14a of a lead frame 14 after the ball at the wire top end is bonded to an electrode 15a. If the bonding condition of the wire to the electrode 15a is good, an a-c current flows on the wire 12. A detector circuit 20 detects this current through a pickup coil 18, etc., to provide for the controller 21 with an output indicating the bonding is good. If any peel appears between the wire 12 and electrode 15a, no current flows on the wire and detector circuit 20 judges the bonding to be defective. |
