| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for polishing a semiconductor substrate without taking account of the curvature of upper and lower lapping plates while decreasing the polishing margin. SOLUTION: The apparatus for polishing and flattening the surface of a laminate formed on a semiconductor substrate 13 comprises a fixed abrasive grain ring 23 touching a part of the surface of the semiconductor substrate 13 to be polished, an upper lapping plate 24 fixed with the abrasive grain ring 23 and turning at the time of polishing, a lower lapping plate 21 fixed with the semiconductor substrate 13 oppositely to the abrasive grain ring 23 and turning at the time of polishing, and a traverse mechanism 22 for reciprocating the lower lapping plate 21 relatively to the upper lapping plate 24 at the time of polishing. The apparatus further comprises means for supplying pure water 26 between the fixed abrasive grain ring 23 and the semiconductor substrate 13 from the inside and the outside of the fixed abrasive grain ring 23. |
