| 摘要 |
PROBLEM TO BE SOLVED: To fill a gap between a resin covering a metal member and a metal member with a hot-melt adhesive to provide improved airtightness by interposing the hot-melt adhesive between the metal member including an exposed boundary of the metal member and the resin. SOLUTION: A resin molded body 8 is a container which measures 5×4mm in flat plane and 2mm in thickness, and a copper lead frame, as a metal frame 3 (0.7mm in width, 0.25mm in thickness), is inserted and molded into the body B. At the time of molding, at first the metal frame 3 only is heated to 300 deg.C and by utilizing the heat thereof, a hot-melt adhesive 9 is melted and applied to the frame 3 in a thin layer. After cooling it, the frame 3 is set in a molding die and thermoplastic resin is injected into the die at 350 deg.C using an injection molding machine to provide the resin molded body 8 into which the lead frame in inserted. Airtightness of the molded body is held and when the body is applied to parts for packages of semiconductor devices, a lowering of performance of semiconductor elements in the package due to water can be avoided. |
