| 摘要 |
A method of interconnecting a leadless multichip module to a printed wiring board using a solder-free interconnect to form an electronic module. The present invention also contemplates the electronic module produced by the method. The electronic module comprises a printed wiring board having a plurality of interconnect pads, and a leadless multichip module having a base, and a plurality of interconnect pads. The multichip module is disposed in an upside down configuration such that its plurality of interconnect pads face the plurality of interconnect pads of the printed wiring board. A plurality of solder-free interconnects are disposed between the interconnect pads. A nonconductive frame is disposed around the leadless multichip module and is secured to the printed wiring board. The nonconductive frame also secures the multichip module and the plurality of solder-free interconnects to the printed wiring board. This compresses the plurality of solder-free interconnects to cause electrical connection between the interconnect pads. A heat sink is disposed adjacent the base of the leadless multichip module, and is secured to the printed wiring board. A thermal gasket may be disposed between the heat sink and the multichip module, as required.
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