| 摘要 |
PROBLEM TO BE SOLVED: To test an actually manufactured semiconductor component without using a large scaled additional circuit by executing the testing directly using CAD data obtained by designing the semiconductor component by using a CAD system. SOLUTION: A test vector in CAD data is decoded and the existence of an event (variation of waveform) is stored in an event memory 42. A delay time with respect to a basic cycle of the event is stored in a delay data memory 38 and the variation of waveform of the test vector is stored in a waveform data memory 40. A counter 34 is incremented by a reference clock cycle and the test vector is generated from the starting by using the data accumulated in the memories 38, 40, 42. Output data indicative of occurrence of the event outputted from the memory 42 is applied to a time delay circuit 44 to be outputted to a waveform shaping circuit 46 by delaying a time period from the memory 38, then the testing signal is shaped in accordance with the data stored in the memory 40. An output of the circuit 46 is applied to a device 50 to be measured then the testing to determine whether or not the actual semiconductor component operates along the designing data is executed. |
