| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a semiconductor device at low cost by forming solder bumps on outer electrodes mounted on a carrier, connected to outer leading electrodes on a chip through wires, pads and conductor lines. SOLUTION: Outer leading electrodes 22 are formed on the surface of a chip 21. Pads 24, conductor lines 25 and outer electrodes 26 are formed on the same surface of a carrier 23. The pads 24 and outer electrodes 26 are electrically connected through the conductor lines 25. Solder bumps 29 are formed on the electrodes 26 so as to be higher than the height of wires 28. The carrier 23 is e.g. mounted on the chip 21, the pads 24 are connected to the leading electrodes 22 through the wires 28, the pads 24, leading electrodes 22 and wires 28 are sealed with a seal resin 30, a solder is fed to the outer electrodes 26, heated and molten to form solder bumps 29. |
