发明名称 PRINTED WIRING BOARD AND ITS MANUFACTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide a high-reliability printed wiring board having less warp and torsion, and its manufacturing method, wherein metal wirings are firmly stuck to a board, and are connected to conductive pastes filling in through holes electrically and mechanically stably. SOLUTION: This printed wiring board has a plurality of sheet boards consisting of an organic nonwoven fabric 100 of a density of 0.8g/cm<3> or more and resin formation layers 101 containing an inorganic insulating filter formed on its both sides, and two or more electrode layers 106. Through holes 103 are formed in the direction of thickness of the above-mentioned sheet board, and are filled up with conductive resin formations 104. And it has a multilayer interconnection construction having a construction wherein electrical connection is performed at every electrode layer.</p>
申请公布号 JPH09321399(A) 申请公布日期 1997.12.12
申请号 JP19960134023 申请日期 1996.05.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKATANI SEIICHI
分类号 H05K1/11;B32B27/12;H05K1/03;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H05K1/03 主分类号 H05K1/11
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