| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device with a low cost wherein its package for storing a high-consumption-power semiconductor with many pins therein is mounted on its printed wiring board and the procedure for attaching a radiator to its printed wiring board is made simple and the applied loads to its terminals are made low. SOLUTION: To a package 100, a mounting metal 102 is attached from the same side as signal connection balls 105. Mounting a semiconductor chip 101 on the mounting metal 102 in the inside of the package 100, signals are taken out from the chip 101 by wires 103 to seal thereafter the chip 101 with a cap 104. The signal connection balls 105 are connected with the signal portion of the package 100, and heat transferring balls 106 are connected with the mounting metal portion 102 of the package 100. Providing signal connection portions on the surface of a printed wiring board 107, the signal connection balls 105 are connected with them. Providing heat transferring metals 108 in the printed wiring board 107 through it, the heat transferring balls 106 are connected with radiation metal portions of the printed wiring board 107 which are connected subsequently with the heat transferring metals 108. Then, a radiator 109 is attached to the printed wiring board 107 from the opposite side of its package mounting surface, in contact with the heat transferring metals 108.</p> |
