发明名称 CONNECTION STRUCTURE OF COVERED ELECTRIC WIRE
摘要 PROBLEM TO BE SOLVED: To provide a connection structure of a covered electric wire with which conductive resistance is decreased and at the same time mechanical strength is improved by improving the structure of a pair of resin chips to seal the connection part of the covered electric wire. SOLUTION: This covered electric wire is produced by covering the outer circumference of a conductive wire part 1 of at least one of members, which are electrically connected each other, with a resin covering part 3 and both members W1, W2 are overlapped in a connection part S and the overlapped connection part S is sandwiched with a pair of resin chips 13, 15. Then, both members W1, W2 are electrically contacted in the connection part S by dispersing and melting the coating part 3 by ultrasonic vibration and also pressuring through the resin chips 13, 15 from outside and after that the resin chips 13, 15 are mutually joined by welding to seal the connection part S. In this case, first welding parts 21a (of 13 side), 31a (of 15 side) to seal the connection part S by joining these parts each other by welding in the region including the connection part S and second welding parts 22 (of 13 side), 32(of 15 side) separately formed from the first welding parts and to be joined each other by welding in the region outside of part S are respectively formed in the resin chips 13, 15.
申请公布号 JPH09320650(A) 申请公布日期 1997.12.12
申请号 JP19960141862 申请日期 1996.06.04
申请人 YAZAKI CORP 发明人 IDE TETSUO;ASAKURA NOBUYUKI
分类号 H01R4/24;H01R4/00;H01R4/02;H01R4/70;H01R43/00;H01R43/02;(IPC1-7):H01R4/24 主分类号 H01R4/24
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