发明名称 COOLING STRUCTURE OF ELECTRONIC UNIT BOX
摘要 PROBLEM TO BE SOLVED: To enhance adiabatic or radiation characteristics in the high temperature atmosphere of an electronic unit. SOLUTION: In a first structure, an air layer is formed between a primary peripheral wall on the outer side and a secondary peripheral wall on the inner side of an electronic unit box, and an air supply port and an air discharge port are provided in the primary peripheral wall, and an electronic box housed in the secondary peripheral wall is cooled by an air layer. An adiabatic material is provided inside the primary peripheral wall and outside the air layer. Further, in a second structure, an electronic unit 28 is housed in a peripheral wall 35 of the electronic unit box. An air layer 27 is formed between the peripheral wall 35 and the electronic unit 28, and a through hole 38 corresponding to an air supply port 30 and a through hole 39 corresponding to an air discharge port 31 are provided in the peripheral wall 35, and the electronic unit 28 can directly be cooled by a cooling air 32. Further, an adiabatic material 37 is filled in between an outer peripheral wall 36 located outside the peripheral wall 35 and the peripheral wall 35.
申请公布号 JPH09321473(A) 申请公布日期 1997.12.12
申请号 JP19960129953 申请日期 1996.05.24
申请人 YAZAKI CORP 发明人 YAMADA HIROAKI
分类号 B60R16/02;F25D1/00;H02G3/08;H05K7/20 主分类号 B60R16/02
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