发明名称 COOLING STRUCTURE OF ELECTRONIC UNIT BOX
摘要 PROBLEM TO BE SOLVED: To provide a structure capable of cooling locally a heat generating source of an electronic unit. SOLUTION: In a cooling structure, an air layer 6 is formed between a peripheral wall 3 outside an electronic unit box and a peripheral wall 5 inside it, and an air supply port 7 and a discharge port 9 are provided in the peripheral wall 3, and an electronic unit 18 having a heat generating source 11 is provided in the peripheral wall 5, and the electronic unit is cooled by a cooled air 8, and a projecting part 13 is provided on an inner wall face of the peripheral wall 3 counter to the heat generating source, and a narrow part 14 of an air layer is formed between the projecting part and a heat source location of the peripheral wall 5. The projecting pant 13 is extended in the air layer 6 from a bottom part of the peripheral wall 3 to the upper part in a height direction, and a guide inclined face 13a for blowing the cooled air 8 toward the heat generating source 11 is formed in the projecting part 13.
申请公布号 JPH09321474(A) 申请公布日期 1997.12.12
申请号 JP19960129954 申请日期 1996.05.24
申请人 YAZAKI CORP 发明人 ONO MAMORU
分类号 F25D1/00;H02G3/08;H05K7/20 主分类号 F25D1/00
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