发明名称 METHOD OF DETECTING BONDING DEFECT IN BUMP FORMATION AND BONDING DEFECT DETECTOR, AND METHOD FOR CONTROLLING BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent a bonding defect and prevent the clogging of a capillary, by detecting the bonding detect, based on whether the absolute value of the output voltage of a torch power source to apply high voltages is over the preset value or not. SOLUTION: In the case of forming a bump by ball bonding method, the bonding defect is detected, based on whether the absolute vale of the output voltage of a torch power source 1 to apply high voltage is over the preset value or not. Fox example, if a high level of output can be gotten from the comparison circuit by comparing the output voltage value of the torch power source 1 divided with resistors with the judgment criteria voltage value corrected by the value of the resistance by means of a comparison circuit 2, it is judged that it was a misjudge. Then, an RS flip-flop 3 is set with the output of the comparison circuit 2, and is reset by the rest signal from a computer for control after input of data to indicate that it is faulty into the computer of control.
申请公布号 JPH09321095(A) 申请公布日期 1997.12.12
申请号 JP19960129660 申请日期 1996.05.24
申请人 SHARP CORP 发明人 SATOU TOMOTOSHI
分类号 H01L21/60 主分类号 H01L21/60
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