| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent contamination due to cutting and efficiently clean a wafer by cleaning the wafer with cleaning water, to which supersonic with a mega Hertz frequency band is applied in cutting the wafer. SOLUTION: A blade 3 provided in a wheel cover 2 is mounted at the leading edge of a spindle, which revolves at a high speed, to rotate in a prescribed direction. In the wheel cover 2, supply pipes 4 and 5 are provided for supplying cleaning water C, and at the leading edge of the supply pipes 4 and 5, supply nozzles 4a and 5a are formed to jet the cleaning water C. Then, in the middle of each supply pipe, a megasonic vibrating equipment 6 is provided, and the water molecules of the cleaning water C in the supply pipes 4 and 5 are excited by the mega Hertz frequency vibration of the vibrator of the megasonic vibrating equipment 6. Thus, contamination due to cutting of water W is prevented and cleaning is efficiently performed.</p> |
