发明名称 WAFER TRANSFER DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a wafer transfer device which can easily transfer a plurality of wafers between carriers in a short time. SOLUTION: In this device 1, a plurality of wafers W housed slidably along the wafer face at predetermined intervals in a carrier 2A are slid and transferred to a carrier 2B which houses the plurality of wafers W. In this case, the device 1 has: a transfer arm 3 comprising a plurality of arms 3a having contact parts 3b which come into contact with outer peripheral parts of adjacent two wafers W and a space 3s formed between the arms 3a into which two adjacent wafers W can be inserted; and a driving means for moving the transfer arm 3 from the carrier 2A to the carrier 2B.</p>
申请公布号 JPH09321121(A) 申请公布日期 1997.12.12
申请号 JP19960136374 申请日期 1996.05.30
申请人 SONY CORP 发明人 NIINA SHUJI
分类号 B65G49/07;H01L21/673;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65G49/07
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