| 摘要 |
PROBLEM TO BE SOLVED: To improve radiation property and cope with a high heat value due to high speed and high integration by a method wherein a heat transmission member for releasing heat generated in a semiconductor chip to a printed board via a package substrate is provided in a fourth region located on the back side of a first region. SOLUTION: An upper face 17 of a package substrate 13 has a first region 17a mounting a semiconductor chip 1; and a second region 17b provided with a wiring 19 connecting with the semiconductor chip 1 and provided in the package substrate 13. Further, on the other face 25 of the package substrate 13, the wiring 19 is connected to a printed board 15 via electric connection members 31, 27 in a third region 25a located on the back side of the second region 17b. A heat transmission member 29 for releasing heat generated in the semiconductor chip 1 to the printed board 15 via the package substrate 13 is provided in the fourth region 25b located on the back side of the first region 17a. Thereby, a small-sized semiconductor package 32 excellent in heat radiation and electric characteristics can be formed.
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