SEMICONDUCTOR SUBSTRATE CARRYING JIG AND CARRYING BOX

摘要

PROBLEM TO BE SOLVED: To avoid re-deposit to a wafer the dust deposited to a carrier and carrying box and improve the yield of semiconductor devices by providing an adhesive sheet having fine protrusions on the wall facing a housed and fixed semiconductor substrate. SOLUTION: A carrier 1 has an adhesive sheet 2 having fine bumps on the wall facing a wafer 3 inside. Dust 4 in an atmosphere never peels if once adhered to the sheet 2 and hence this prevents the dust 4 once deposited to the carrier 1 and carrying box from re-depositing to the wafer. The carrier 1 and box have the sheets 2 at other inner walls than contact parts of the carrier 1 and box. The sheet 2 has fine bumps to enlarge the surface area easy to catch the dust 4 and block once caught dust from escaping. This improves the semiconductor substrate yield.