发明名称 LEAD FORMING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To prevent positional shift of molds and a lead and to form a plate layer, which is soft and even easily ground but is not peeled off, on a lead surface, by horizontally moving a first mold to a lead base side in a state where the first mold and a second mold hold a floating end of the lead between them, and at the same time, projecting the first mold toward the second mold side. SOLUTION: First and second molds 13 and 14 hold the tip end of a lead 3 between them, and in this status, the first mold 13 is moved to a lower pad 8 side and at the same time raised. The movement as the combination of horizontal movement and elevation may be a linear movement, however, preferably, the movement may trace a circular arc which does not loosen the lead or if loosens, minimize the looseness. The lead 3 begins to bend at a portion held by pads 8 and 12 and a portion held by the first and second molds 13 and 14. The deforming portions of the lead 3 do not cause positional shifts relative to the molds. As the intermediate portion of the lead does not come in contact with the molds, the plate layer covering the lead 3 is not peeled off.</p>
申请公布号 JPH09321204(A) 申请公布日期 1997.12.12
申请号 JP19960138650 申请日期 1996.05.31
申请人 NEC KANSAI LTD 发明人 YOSHIKAWA KEIICHI
分类号 B21D5/01;H01L23/50;(IPC1-7):H01L23/50 主分类号 B21D5/01
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