摘要 |
PROBLEM TO BE SOLVED: To enable highly accurate measurement without being affecting by the size of a semiconductor part in an apparatus for measuring the deviation of the semiconductor part to be supplied to a T/F(trim and form) device. SOLUTION: For example, a support base 21 is driven oppositely by a motor and a semiconductor part 10 on the support base 21 is rotated by an angle -α. The semiconductor part 10 is scanned by a laser light from a laser scanner to measure a length Lb at a length measuring position Ab. Then, the support base 21 is driven in the positive direction to rotate the semiconductor part 10 only by an angle +αof deflection. Then, a length Lc at the length measuring position Ac is measured by the laser scanner. Thereafter, by the addition theorem, a deviation angleθfrom a reference length measuring position A the semiconductor part 10 is calculated based on a length data Lb at the length measuring position Ab and a length data Lc at the length measuring position Ac.
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