| 摘要 |
PROBLEM TO BE SOLVED: To enable manufacture of a hybrid integrated circuit board by a simple manufacturing process without adversely affecting a capacitor and a resistor on the board. SOLUTION: Ta2 N is sputtered on the entire surface of a board, thus forming a Ta2 N layer 3 for a resistor. Then, patterning into the shape of the resistor is performed to form the Ta2 N layer 3 in a desired shape by RIE. After that, Ta as a material of a dielectric substance of a capacitor is sputtered to cover a Cu-Ni layer 11, thus forming a Ta layer 15 having a thickness of 1μm. In this case, in order to prevent Ta from contacting the resistor, sputtering is partly performed using a metal mask 17 made of a metal which is attracted by a magnetic force. Then, patterning to the size of a lower electrode 11 of the capacitor is performed, and the Ta layer 15 at a portion protruding from the lower electrode 11 is etched by RIE.
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