| 摘要 |
PROBLEM TO BE SOLVED: To reduce the capacity of a package and obtain a stable high-frequency characteristic by attaching a plurality of monolithic microwave integrated circuits (MMIC's) onto the same metal substrate, while attaching a dielectric spacer to partition the respective MMIC's to the substrate, and sealing the package. SOLUTION: A package 10 for microwave circuits has a structure where monolithic microwave integrated circuits (MMIC's) 11 and 12 are attached onto a metal substrate 3 and the package is sealed. Besides the plurality of MMIC's 11 and 12 on the same metal substrate 3, a dielectric spacer 15, partitioning the MMIC's 11 and 12, is attached to the substrate 3, and the package 10 is sealed. By attaching the dielectric spacer 15 partitioning the MMIC's 11 and 12 and sealing the package 10, the capacity of the package can be reduced. The dielectric spacer 15 is provided between the MMIC 11 and DC terminals 34 and 35, and the MMIC 12 and DC terminals 36 and 37 such that these groups are arranged substantially symmetrically to each other. This prevents occurrence of a spurious wave mode, abnormal resonance and the like. |
