| 摘要 |
PROBLEM TO BE SOLVED: To prevent an increase in a stress during at a soldering part between a terminal pin and a circuit substrate. SOLUTION: A longer diameter of a held part 2 and a shorter play movement permission part 21 are formed at a terminal pin 20, so that an alignment plate 30 can be moved against a connector housing 11. When the held part 22 is engaged with a positioning pore 31, the terminal pin 20 is arrayed. After being mounted on a circuit substrate P, the alignment plate 30 is moved to permit the positioning pore 31 to correspond to the play movement permission part 21, and a relative position between the terminal pin 20 and the positioning pore 31 is permitted. Even if the positioning pin 31 is shifted with respect to the terminal pin 20 during thermal expansion, the terminal pin 20 is not pressed at a pore edge of the positioning pore 31, therefore, a stress of a soldering part M is never increased. |
