| 摘要 |
PROBLEM TO BE SOLVED: To eliminate defect such as disconnection and short-circuiting caused by a difference of height between a through hole filler and a wiring conductor film in a thin film wiring conductor of a multilayer wiring part formed on a main surface of a wiring board. SOLUTION: A wiring board consists of an insulation board 1 with a throughhole 1a passing through both upper and lower main surfaces, a wiring conductor film 2 formed in at least one main surface of the insulation board 1, a throughhole conductor film 6 which is formed in an inner wall of the through hole 1a and is electrically connected to the wiring conductor film 2, a throughhole filler 7 put inside the through hole 1a and a multilayer wiring part 3 which is formed in at least one main surface wherein the wiring conductor film 2 of the insulation board 1 is formed and formed by laminating an organic insulation film 4 and a thin film wiring conductor 5 alternately. As for the throughhole filler 7, a central region in a thickness direction of the throughhole 1a consists of a resin material 7a and a region near an opening consists of a metallic material 7b, and one surface of the throughhole filler 7 is positioned in the practically same plane as the wiring conductor film 2. |
