| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multilayer high frequency circuit board with less characteristic deterioration in a high frequency circuit due to undesired coupling. SOLUTION: In order to penetrate bias connection throughholes 6 to connect bias patterns 3a, 3b on an outer face of the multilayer high frequency circuit board to inner layer bias patterns 9, grounding throughholes 8 connecting to 1st and 2nd connection conductors 4, 5 are arranged at an interval of 1/2 of a carrier wavelength with respect to the highest operating frequency of a high frequency around a hole 7 made to the 1st ground conductor 4 so as to short- circuit the 1st and 2nd ground conductors in terms of high frequencies. Thus, the occurrence of the undesired propagation mode is suppressed, where a high frequency signal leaked to the bias pattern is propagated through an inner layer between the 1st and 2nd ground conductors of the multilayer high frequency circuit board as the propagation line. |
