| 摘要 |
PROBLEM TO BE SOLVED: To reduce the wire deformation at the encapsulation with resin, and improve the reliability while keeping the electric insulating property between wires, and reduce the used quantity of gold, by using a metallic wire including thermosetting resin, as a bonding wire. SOLUTION: As a bonding wire 5 for electrically connecting a semiconductor pellet with a lead frame, a metallic wire 8 including thermosetting resin 7 is used. For example, as a bonding wire 5, an object of such a structure that a metallic cover 6 such as aluminum or the like covers the nucleus of thermosetting resin 7 or that the metallic wire 8 contains a plurality of fine lines of thermosetting resin 7. Hereby, the bonding wire 5 hardens by the heat in sealing with resin, the tenacity of the bonding wire 5 increases, and the flow of the wire 5 can be reduced. Moreover, since a part of the bonding wire 5 has thermosetting resin, the cost can be reduced by lessening the used quantity of gold. |
