| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent wire exposure upon resin sealing and improve reliability by providing a suspension lead, holding an island to carry a semiconductor device, with reinforcing structure. SOLUTION: In the lead frame, a rib structure 8 is provided to a suspension lead 2, holding an island 3 to carry a semiconductor device 5, on its outer frame of the lead frame. Then, the semiconductor device 5 is mounted on the lead frame having the suspension lead 2 with the rib structure 8. Next, electrode pads of the semiconductor device 5 and inner leads 4 are interconnected by a bonding wire 6. Finally, the lead frame is sealed by using sealing resin 7. At this time, as the lead frame has a high strength since the suspension lead 2 has the rib structure 8. Accordingly, even if filling difference occurs at the time of resin sealing, the island does not easily sift, and the bonding wire 6 is not exposed on the surface of the package.</p> |
